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Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Auto Mold System Semiconductor Chip Making Machine High Efficiency

Guangdong Taijin Semiconductor Technology Co., Ltd
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Auto Mold System Semiconductor Chip Making Machine High Efficiency

Brand Name : TJIN

Place of Origin : China

MOQ : 1 set

Certification : ISO9001

Delivery Time : 40 days

Packaging Details : Wooden Packing

Application : Semiconductor Manufacturing

Capacity : 1000 tons

Clamping Force : 1000 kN

Injection Pressure : 200 MPa

Injection Speed : 100 mm/s

Injection Unit : Single

Max. Mold Height : 1000 mm

Min. Mold Height : 400 mm

Model : SM-1000

Platen Size : 1200 x 1200 mm

Power Supply : 3-phase, 380V, 50Hz

Screw Diameter : 80 mm

Type : Injection Molding Machine

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Auto Mold System

Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● Automatic cassette loading, double cassette stacked loading;

● Supports flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

● WIN10 + 15 inch touch screen + touch keyboard;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;

● Customized on demand, permanently provide quality service.

Technical Parameters:

Type Vertical Injection Molding Machine
Control System PLC
Model SM-1000
Cooling System Water
Weight 5 Tons
Clamping Force 1000KN
Capacity 100 Tons
Screw Diameter 35 Mm
Max. Mold Height 400Mm
Injection Pressure 200 Mpa
Auto Transfer Molding Yes
Auto Packaging Equipment Yes

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

FAQ:

  • Q: What is the brand name of this product?
  • A: The brand name of this product is TJIN.
  • Q: What is the model number of this product?
  • A: The model number of this product is 001.
  • Q: Where is this product made?
  • A: This product is made in China.
  • Q: Does this product have any certifications?
  • A: Yes, this product is ISO9001 certified.
  • Q: What is the minimum order quantity for this product?
  • A: The minimum order quantity for this product is 1.
  • Q: How is this product packaged?
  • A: This product is packaged in wooden packaging.
  • Q: What is the estimated delivery time for this product?
  • A: The estimated delivery time for this product is 40 days.
  • Q: What are the payment terms for this product?
  • A: The payment terms for this product are TT (Telegraphic Transfer).

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