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: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Product Categories

Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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Semiconductor Molding Machine, Trim And Form Machine and IC Lead Frame Stamping Mold

                
Energy Efficient Semiconductor Molding Machine Automatic Encapsulation Equipment

Auto Mold System Semiconductor Chip Making Machine High Efficiency

Auto Transfer Molding Semiconductor Manufacturing Machine High Capacity

PLC Control Efficient Chip Molding Machine In Semiconductor Manufacturing System

Auto Molding System In Semiconductor Fabrication Equipment 1000 Tons Capacity

Automated Semiconductor Molding Process Semicon Molding Equipment 100kW

Single Injection Unit Semiconductor Molding Machine With 35Mm Screw

High Efficiency Semiconductor Molding Machine With PLC Control System

Injection Pressure 200MPa Semiconductor Molding Machine High Precision

PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making

Auto Plasticizing Press Semiconductor Chip Manufacturing Machines ISO9001

Highly Automation Semiconductor Fabrication Machines Semicon Molding Equipment

Company Introduction

Guangdong Taijin Semiconductor Technology Co., Ltd

Account Registered in: 2024

Last Login Date: May 10, 2025

Business Type:: Manufacturer,Exporter,Seller

Number of Employees:: 500~800

Year of Establishment:: 3 milliom

Main Markets:: North America,South America,Western Europe,Eastern Europe,Eastern Asia,Southeast Asia,Middle East

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